| PART |
Description |
Maker |
| CYM8301BV33-10BGC CYM8301BV33-10BGI CYM8301BV33-12 |
512K X 24 MULTI DEVICE SRAM MODULE, 12 ns, PBGA119 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
512K X 24 MULTI DEVICE SRAM MODULE, 10 ns, PBGA119 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
null : SRAM Modules
|
Cypress Semiconductor, Corp.
|
| 89LV1632RPQK-30 |
16 Megabit (512K x 32-Bit) Low Voltage MCM SRAM 512K X 32 MULTI DEVICE SRAM MODULE, 30 ns, CQFP68
16 Megabit (512K x 32-Bit) Low Voltage MCM SRAM 16兆位12k × 32的位）低压亿立方米的SRAM
|
Maxwell Technologies, Inc
|
| AS7S512K32P-45M |
512K X 32 MULTI DEVICE SRAM MODULE, 45 ns, CPGA66
|
AUSTIN SEMICONDUCTOR INC
|
| WS128K32-25HSME |
512K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66
|
WHITE ELECTRONIC DESIGNS CORP
|
| AK632128G-35 AK632128G-25 AK632128G-20 |
512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, SMA64
512K X 8 MULTI DEVICE SRAM MODULE, 25 ns, SMA64
512K X 8 MULTI DEVICE SRAM MODULE, 20 ns, SMA64
|
Black Box, Corp.
|
| WS512K8-45Q WS512K8L-35Q WS512K8L-45Q |
512K X 8 MULTI DEVICE SRAM MODULE, 45 ns, CDIP32
512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, CDIP32
|
WHITE ELECTRONIC DESIGNS CORP
|
| MF31M1-M6DAP01 |
512K X 16 MULTI DEVICE SRAM CARD, 200 ns, XMA60
|
|
| CY7C1372CV25-167AI CY7C1372CV25-167BGI CY7C1372CV2 |
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 1M X 18 ZBT SRAM, 3 ns, PQFP100
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 1M X 18 ZBT SRAM, 3 ns, PBGA165
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 1M X 18 ZBT SRAM, 3 ns, PBGA119
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 1M X 18 ZBT SRAM, 2.8 ns, PBGA119
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 1M X 18 ZBT SRAM, 2.8 ns, PBGA165
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 512K X 36 ZBT SRAM, 3 ns, PBGA165
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 512K X 36 ZBT SRAM, 3 ns, PQFP100
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 512K X 36 ZBT SRAM, 3.4 ns, PQFP100
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 512K X 36 ZBT SRAM, 3.4 ns, PBGA165
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 12k × 36/1M × 18流水线的SRAM架构的总线延迟
CAP,Ceramic,10000pF,500VDC,10-% Tol,10% Tol,X7R-TC Code,-15,15%-TC,30ppm-TC RoHS Compliant: Yes
512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
|
Cypress Semiconductor, Corp.
Cypress Semiconductor Corp.
|
| CYM1464 CYM1464PD-22C CYM1464PD-30C CYM1464PD-45C |
512Kx8 Static RAM Module 512K X 8 MULTI DEVICE SRAM MODULE, 20 ns, DMA32
512Kx8 Static RAM Module 512K X 8 MULTI DEVICE SRAM MODULE, 25 ns, DMA32
512Kx8 Static RAM Module 512K X 8 MULTI DEVICE SRAM MODULE, 55 ns, DMA32
|
Cypress Semiconductor, Corp.
Cypress Semiconductor Corp.
|
| SYS321000LK-012 SYS321000LK-015 SYS321000ZK-015 SY |
1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72 PLASTIC, SIMM-72
1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PZIP72 PLASTIC, ZIP-72
1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PSMA72 PLASTIC, SIMM-72
1M X 32 MULTI DEVICE SRAM MODULE, 12 ns, PZIP72 PLASTIC, ZIP-72
x32 SRAM Module X32号的SRAM模块
1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PZIP72 PLASTIC, ZIP-72
|
Sumida, Corp.
TE Connectivity, Ltd.
|
| AS8S128K32PN-17/XT AS8S128K32PN-25/XT AS8S128K32PN |
128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, PGA66 PGA-66
128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, PGA66 PGA-66
128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PGA66 PGA-66
128K X 32 MULTI DEVICE SRAM MODULE, 45 ns, PGA66 PGA-66
128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 CERAMIC, QFP-68
|
Micross Components
Austin Semiconductor, Inc
|
| PUMA68SV32000BM-020 PUMA68SV32000BI-015 |
1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PQCC68 25.27 X 25.27 MM, 5.08 MM HEIGHT, PLASTIC, LCC-68
1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PQCC68
|
ST Microelectronics
|
|
